Microelectronics

In semiconductor manufacturing, front end advanced production methods demand very clean air supply with cleanliness requirements constantly increasing. The critical particle size for wafer environment is now below 25 nm (2009) and predictions are made that this size will continue to shrink towards 10 nm by 2017.

The benefits of removing airborne molecular contamination (AMC) from the air inside cleanroom or manufacturing tools are now very well established. Major contaminants include ammonia, sulfur compounds, acidic compounds or volatile organic compounds (VOC); and cleanroom/tool air concentration limits are often set below 1 ppb(v).

Thanks to more than 15 years experience in the field of microelectronics and semiconductor contamination control and through its involvement in the International Technology Roadmap for Semiconductors, Camfil Farr is well positioned to recommend the best solution for advanced particle and AMC control."